3rd ACM SIGPLAN Program Protection and
Reverse Engineering Workshop (PPREW 2014)

The US Grant, San Diego, CA
January 25, 2014
Collocated with POPL 2014

Call for Papers

Submissions can  address studies on either hardware/circuit based methods or software/assembly based mechanisms. We expect the workshop to provide exchange of ideas and support for cooperative relationships among researchers in industry and academia.

Papers must describe original work, be written and presented in English, and must not substantially overlap with papers that have been published or that are simultaneously submitted to a journal or a conference with refereed proceedings.

Submission Guidelines

Original, unpublished manuscripts of up to 12-pages including figures and references must follow the ACM proceedings format. SIGPLAN conference paper templates are available for LaTeX and Word at http://www.sigplan.org/Resources/Author (use the 9 pt template). Submissions must be in PDF.

Submitted papers must adhere to the SIGPLAN Re-publication Policy and the ACM Policy on Plagiarism. Concurrent submissions to other conferences, workshops, journals, or similar forums of publication are not allowed. Submissions that do not meet these guidelines may not be considered.

The URL for submission of papers is through Easy Chair